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NXP產(chǎn)品 - BGS8H2介紹
BGS8H2 - SiGe:C Low Noise Amplifier MMIC with bypass switch for LTE

BGS8H2是NXP公司的一款LNAs產(chǎn)品,BGS8H2是SiGe:C Low Noise Amplifier MMIC with bypass switch for LTE,本站介紹了BGS8H2的封裝應(yīng)用圖解、特點(diǎn)和優(yōu)點(diǎn)、功能等,并給出了與BGS8H2相關(guān)的NXP元器件型號(hào)供參考。

BGS8H2 - SiGe:C Low Noise Amplifier MMIC with bypass switch for LTE - LNAs - RF MMIC放大器與混頻器 - 恩智浦, LLC

產(chǎn)品描述

The BGS8H2 is a Low Noise Amplifier (LNA) with bypass switch for LTE receiver applications,available in a small plastic 6-pin extremely thin leadless package. The BGS8H2 requiresone external matching inductor.

The BGS8H2 delivers system-optimized gain for both primary and diversity applications wheresensitivity improvement is required. The high linearity of these low noise devicesensures the required receive sensitivity independent of cellular transmit power level inFDD (Frequency Division Duplex) systems. When receive signal strength is sufficient, theBGS8H2 can be switched off to operate in bypass mode at a 1 μA current, to lower powerconsumption.

The BGS8H2 is optimized for 2300 MHz to 2690 MHz.

產(chǎn)品特性和優(yōu)勢(shì)
  • Operating frequency from 2300 MHz to 2690 MHz
  • Noise figure (NF) = 1.0 dB
  • Gain 12.5 dB
  • Bypass switch insertion loss of 2.3 dB
  • High input 1 dB compression point of -1.5 dBm
  • High in band IP3i of 4 dBm
  • Supply voltage 1.5 V to 3.1 V
  • Self shielding package concept
  • Integrated supply decoupling capacitor
  • Optimized performance at a supply current of 5.8 mA
  • Power-down mode current consumption < 1 μA
  • Integrated temperature stabilized bias for easy design
  • Require only one input matching inductor
  • Input and output DC decoupled
  • ESD protection on all pins (HBM > 2 kV)
  • Integrated matching for the output
  • Available in 6-pins leadless package 1.1 mm x 0.7 mm x 0.37 mm; 0.4 mm pitch:SOT1232
  • 180 GHz transit frequency - SiGe:C technology
  • Moisture sensitivity level of 1
產(chǎn)品應(yīng)用
  • LNA for LTE reception in smart phones, feature phones, tablet PCs and RFfront-end modules
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